HTD GROUP (HONGKONG) LIMITED

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ssd pcb
Specification: 4 layer
Detail: material:FR-4 board thickness:1.0mm surface finish:Imm gold solder:black silkscreen:white

impedance control pcb
Specification: 2 layer
Detail: material:FR-4 board thickness:1.0mm surface finish:Imm gold solder:green silkscreen:white

led pcb
Specification: Thickness:1.2mm
Detail: Material:aluminum Board thickness:1.2mm Layer:single Outer Cu:1oz Surface Finished: HASL Tin

blue pcb
Specification: Thickness:1.2mm
Detail: Material:FR4 Board thickness:1.2mm Layer:4 Outer Cu:1oz Surface Finished: Imm Gold Special Technology;HALF HOLE,BGA

red pcb
Specification: Thickness:1.2mm
Detail: Material:FR4 Board thickness:1.2mm Layer:4 Outer Cu:1oz Surface Finished: Imm Gold

blind-buried board
Specification: 2.0mm
Detail: Material:FR-4 Tg180 Board Thickness:1.3mm Min Hole Size:0.25mm Surface Finish:Imm gold

double-sided pcb
Specification: 120mm*80mm
Detail: Material:FR-4 Board thickness:1.6mm Layer:2 Solder colour: Green Silkscreen:White Surface finish:HAL

double-sided pcb
Specification: 120mm*80mm
Detail: Material:FR-4 Board thickness:1.6mm Layer:2 Solder colour:Green Silkscreen:White Surface finish:OSP

double-sided pcb
Specification: 30mm*40mm
Detail: Material:FR-4 Board thickness:1.0mm Layer:2 Solder colour:Green Silkscreen:White Surface finish:Gold plating

double-sided pcb
Specification: 150mm*170mm(1*2)
Detail: Material:FR-4 Halogen-free Board thickness:2.0mm Layer:2 Solder colour:Green Silkscreen:White Surface finish:OSP


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