HTD GROUP (HONGKONG) LIMITED

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high-frequency pcb
Specification: 150mm*75mm
Detail: Material:FR-4 Board thickness:0.8mm Layer:2 Solder colour:Green Silkscreen:White Surface finish:Gold plating

pcb of third-order hdi board
Specification: Thickness:1.0mm
Detail: Board Thickness:1.0mm Third-order HDI Board, Solder Colour:blue Silkscreen:white. Surface Finish:Imm Gold

pcb of any layer interconnect board
Specification: Any layer interconnect board
Detail: Any Layer Interconnect Board.

8 layer pcb board
Specification: Rogers
Detail: Thickness:2.4mm,High frequency R04350b&FR4,immersion gold board.

(1+6+1) hdi pcb
Specification: Thickness:1.0mm,solder:green,surface:immersion
Detail: Material:FR-4 Board Thickness:1.0mm Surface Finish:Imm gold Special:d.(1+6+1) HDI BoarD

(1+4+1) hdi pcb
Specification: Thickness:1.0mm
Detail: Material:FR-4 Board Thickness:1.0mm Surface Finish:Imm gold SpeciaL:(1+4+1) HDI

12 layer pcb board
Specification: Thickness:3.0mm
Detail: Material:FR-4 TG Board Thickness:3.0mm Layer:12 Surface Finish:Imm gold Special: blind orifice High-power Type:Power Board

cu base pcb
Specification: PTFE
Detail: Material:Cu+Base+PTFE Board Thickness:1.2mm, SurfaceFinish:Immersion Gold Special Technology:Technology with step slot&step hole.


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