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HTD GROUP (HONGKONG) LIMITED
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Telecom Electronics
Showing 1 - 7 of 7, total 1 pages [First] [Previous] [Next] [Last]
1
high-frequency pcb
Specification: 150mm*75mm
Detail: Material:FR-4 Board thickness:0.8mm Layer:2 Solder colour:Green Silkscreen:White Surface finish:Gold plating
2
pcb of third-order hdi board
Specification: Thickness:1.0mm
Detail: Board Thickness:1.0mm Third-order HDI Board, Solder Colour:blue Silkscreen:white. Surface Finish:Imm Gold
3
pcb of any layer interconnect board
Specification: Any layer interconnect board
Detail: Any Layer Interconnect Board.
4
8 layer pcb board
Specification: Rogers
Detail: Thickness:2.4mm,High frequency R04350b&FR4,immersion gold board.
5
(1+6+1) hdi pcb
Specification: Thickness:1.0mm,solder:green,surface:immersion
Detail: Material:FR-4 Board Thickness:1.0mm Surface Finish:Imm gold Special:d.(1+6+1) HDI BoarD
6
(1+4+1) hdi pcb
Specification: Thickness:1.0mm
Detail: Material:FR-4 Board Thickness:1.0mm Surface Finish:Imm gold SpeciaL:(1+4+1) HDI
7
cu base pcb
Specification: PTFE
Detail: Material:Cu+Base+PTFE Board Thickness:1.2mm, SurfaceFinish:Immersion Gold Special Technology:Technology with step slot&step hole.
Showing 1 - 7 of 7, total 1 pages [First] [Previous] [Next] [Last]
1
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